AMAT

APPLIED MATERIALS 0010-59787 Ceramic Heater

Name: APPLIED MATERIALS 0010-59787 Ceramic Heater
Brand: AMAT
SKU: 0010-59787
Availability: InStock

SKU: 0010-59787 In Stock

The AMAT 0010-59787 is a ceramic heater for AMAT platforms. Substrate Loading: Automated single loading chamber | Integrated Modules: Power, vacuum, and gas delivery system | Deposition Process: Low-pressure, low-temperature CVD (LP-CVD). Factory-sealed, live-rack tested, 48-hour burn-in. 12-month warranty. Ships within 24h.

Technical Specifications

AMAT 0010-59787	PECVD reactor is a deposition chamber designed to deposit thin films or layers onto substrates used in various electronic devices and systems. The system employs a Chemical Vapor Deposition (CVD) process to deposit the desired film material onto the surface of the substrate.
Reactor Type	PECVD (Plasma Enhanced Chemical Vapor Deposition)
Substrate Loading	Automated single loading chamber
Integrated Modules	Power, vacuum, and gas delivery system
Deposition Process	Low-pressure, low-temperature CVD (LP-CVD)
Process Control	Equipped with user-friendly controllers, the system offers extensive data recording and process control features, ensuring process safety and consistent, reliable results.
Operating Window	Adjustable temperature, pressure, and process parameters
Process Gas	Supports multiple reactive gases
Chamber Design	Easy-to-use chamber design enables excellent deposition uniformity and consistent layer thickness across the substrate surface.
Automation and Integration	The reactor is equipped with an automated loading and unloading chamber, as well as integrated power, vacuum, and gas delivery modules. This design minimizes substrate handling time, ensuring shorter overall processing times.
High Process Temperature	The chamber can achieve higher process temperatures than traditional thermal CVD processes, enabling the production of higher quality thin films.
User-Friendly Operation	The system is designed for simple, intuitive operation, featuring an easy-to-navigate graphical interface and a robust system architecture.
Flexible Processing Parameters	A wide process window allows users to adjust temperature, pressure, and other parameters based on specific deposition needs. This flexibility supports the production of a broad range of high-quality films.
LP-CVD Process	The reactive gas delivery system utilizes low-pressure, low-temperature CVD to deposit the required thin film material onto the substrate surface. The LP-CVD process allows users to select from multiple reactive gases and adjust gas composition, enabling the creation of highly specialized films.
Uniform Thin Film Deposition	The chamber design ensures highly uniform film deposition with the potential for precise and repeatable film thickness profiles across the substrate surface.
Manufacturer	AMAT
Model / SKU	0010-59787